@article{devaux:hal-01213235, TITLE = {{FE simulation of the curing behavior of the epoxy adhesive Hysol EA-9321}}, AUTHOR = {Devaux, Oph{\'e}lie and Cr{\'e}ac'Hcadec, Romain and Cognard, Jean-Yves and Mathis, K{\'e}vin and Lavelle, Florian}, URL = {https://hal.science/hal-01213235}, JOURNAL = {{International Journal of Adhesion and Adhesives}}, PUBLISHER = {{Elsevier}}, VOLUME = {60}, PAGES = {31-46}, YEAR = {2015}, MONTH = Jul, DOI = {10.1016/j.ijadhadh.2015.03.005}, KEYWORDS = {Adhesively-bonded joints ; Curing degree ; Thermal analysis}, HAL_ID = {hal-01213235}, HAL_VERSION = {v1}, }